What are the responsibilities and job description for the Senior Product Lead – Semiconductor & Advanced Packaging position at Intellisoft Technologies?
We are seeking a Senior Product Lead with expertise in Advanced Semiconductor Electronics, ASIC Design, and Chiplet Integration to drive cutting-edge projects in AI and Advanced Packaging.
Location: Hillsboro, Chandler, Folsom, Santa Clara, CA
Duration: 12 Months Contract
Key Responsibilities:
- Lead product development for semiconductor electronics & ASICs.
- Innovate in mixed-signal design, chiplet integration, and high-speed I/O.
- Ensure signal integrity & power integrity throughout the design process.
- Stay ahead of the latest advanced packaging & semiconductor trends.
- Collaborate with cross-functional teams to drive innovation.
Requirements:
- 12 years in semiconductor electronics & ASIC design.
- Strong expertise in mixed-signal & chiplet design, BEOL & FEOL processing.
- Experience with advanced packaging & substrate technologies.
- Bachelor’s/Master’s in Electrical or Computer Engineering (Ph.D. preferred).
- Leadership & project management skills are a plus.
Interested? Apply now or refer a qualified candidate.
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