What are the responsibilities and job description for the Senior Product Lead - Advanced Packaging and Semiconductor Electronics position at OSI Engineering?
Senior Product Lead - Advanced Packaging and Semiconductor Electronics
Position Overview:
We are seeking a Senior Product Lead with deep expertise in Semiconductor Electronics and ASIC Design, particularly in mixed-signal design, chiplet integration, and advanced packaging. This role requires advanced knowledge in BEOL and FEOL semiconductor processing, as well as expertise in current packaging and substrate technologies.
Key Responsibilities:
- Lead product development for advanced semiconductor electronics and ASICs.
- Drive innovations in mixed-signal and chiplet designs, including high-speed chiplet I/O.
- Ensure signal and power integrity across all design phases.
- Collaborate with cross-functional teams to ensure seamless project integration and timely delivery.
- Mentor junior engineers, fostering innovation and continuous learning.
Required Qualifications:
- Bachelor's or master’s degree in electrical engineering, Computer Engineering, or a related field.
- 10 years of experience in semiconductor electronics and ASIC design.
- Expertise in mixed-signal and chiplet design, as well as advanced packaging technologies.
- Strong experience with chiplet integration and high-speed chiplet I/O.
- Proven track record in maintaining signal integrity and power integrity in complex designs.
Preferred Qualifications:
- Ph.D. in a relevant field.
- Experience with leading design and simulation tools.
- Published works or patents in semiconductor technologies.
- Excellent leadership, communication, and project management skills.
Location: On-Site - 5 Days A Week (Santa Clara, CA)
Position Type: Temporary
Salary: $300k - $400k DOE
Education: Bachelor's or master’s degree in electrical engineering, Computer Engineering, or a related field.
No 3rd party agencies or C2C
Abel Lara | 408.550.2800 x119
Abel@OSIengineering.com
Salary : $300,000 - $400,000
