What are the responsibilities and job description for the Memory Packaging and Reliability Lead position at Solidigm?
Our Team
We are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of our vision and mission.
Job Description
We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results-driven, collaborative, passionate, and flexible. The ideal candidate should exhibit the following behavioral traits:
- Team player willing to collaborate across multiple functions.
- Verbal and written communication skills.
- Self-motivated.
Main Responsibilities
- Influence new package/board design, process, and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and package-board interactions.
- Perform package and board design/assembly risk assessments and develop a qualification plan supporting product launch.
- Collection and analysis of all stress test data (HAST, TC, Precon, HTS, SJR).
- Design test vehicles to isolate failure mechanisms and the root causes, e.g., daisy chain test vehicle (DC TV).
- Innovate analytical and experimental methods to validate package technology reliability, especially with respect to SJR.
Requirements
- Bachelor's degree in Mechanical Engineering, Material Science, or related field.
- 4 years of experience in semiconductor package development and reliability.
- Able to engage in root cause analysis, design of experiments, and data analysis.
- Excellent communication skills to work effectively across different geographies.
