What are the responsibilities and job description for the Memory Package Reliability Specialist position at Solidigm?
Solidigm is a leading innovator in the memory industry, combining cutting-edge technology with operational scale to drive innovation. As a NAND package quality and reliability engineer, you will play a critical role in developing and qualifying innovative semiconductor package technologies for our latest products.
The ideal candidate will have a strong background in mechanical engineering, materials science, or a related field, with 4 years of experience in semiconductor package development and reliability. Excellent communication skills and the ability to work effectively across different geographies are essential.
In this role, you will be responsible for influencing new package/board design, process, and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and package-board interactions.
