What are the responsibilities and job description for the NAND Package Reliability Expert position at Solidigm?
About Us
Solidigm is a leading global company that specializes in the development of cutting-edge memory technologies, including NAND packages and Solid-State Drives (SSDs). Our innovative approach to product design and manufacturing has enabled us to become a powerhouse in the memory industry.
Job Overview
We are seeking a highly skilled NAND package quality and reliability engineer to join our Validation, Quality and Reliability team. This role will be responsible for developing and qualifying innovative semiconductor package technologies for our latest products, ensuring they meet the highest standards of quality and reliability.
Main Responsibilities
- Influence new package/board design, process, and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and package-board interactions.
- Perform package and board design/assembly risk assessments and develop a qualification plan supporting product launch.
- Collection and analysis of all stress test data (HAST, TC, Precon, HTS, SJR).
- Design test vehicles to isolate failure mechanisms and the root causes, e.g., daisy chain test vehicle (DC TV).
- Innovate analytical and experimental methods to validate package technology reliability, especially with respect to SJR.
Requirements
- Bachelor's degree in Mechanical Engineering, Material Science, or related field.
- 4 years of experience in semiconductor package development and reliability.
- Able to engage in root cause analysis, design of experiments, and data analysis.
- Excellent communication skills to work effectively across different geographies.
