What are the responsibilities and job description for the Senior Product Lead Advanced Packaging and Semiconductor Electronics position at Synkriom?
Job Details
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Implementation Partner :
Location : Santa Clara, CA (Day One Onsite)
Job Description/Skills: Senior Product Lead Advanced Packaging and Semiconductor Electronics
Senior Product Lead - Advanced Packaging and Semiconductor Electronics
Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a highly experienced Senior Product Lead with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.
Key Responsibilities
Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.
Collaborate with cross-functional teams to innovate and integrate mixed-signal and chiplet designs.
Drive advancements in chiplet integration and high-speed chiplet I/O.
Ensure signal and power integrity throughout the design and implementation phases.
Stay abreast of the latest trends and technologies in advanced packaging and semiconductor processing.Required Qualifications
Bachelor s or Master s degree in Electrical Engineering, Computer Engineering, or a related field.
At least 10 years of experience in semiconductor electronics and ASIC design.
Proficiency in mixed-signal design and chiplet design.
In-depth knowledge of advanced packaging, BEOL and FEOL semiconductor processing.
Experience with current packaging technologies and substrate technologies for advanced packaging.
Strong expertise in chiplet integration and high-speed chiplet I/O.
Proven track record in ensuring signal integrity and power integrity in complex designs.
Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.
Mentor and guide junior engineers, fostering a culture of continuous learning and innovation.
Preferred Qualifications
Ph.D. in a relevant field.
Experience with leading industry-standard design and simulation tools.
Published works or patents in semiconductor technologies.
Excellent leadership, communication, and project management skills.
Contract Position No Benefits.
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