Lead Packaging Engineer

Uviquity is seeking an experienced, hands-on Lead Packaging Engineer to play a critical role in building the next-generation of Far UVC light engines for disinfection and other applications. This position will focus on the optoelectronics packaging of devices. This will require a candidate with the ability to work across multiple disciplines. The candidate should be a hands-on “doer”, eager to take ownership of process challenges and have the ability to execute complex development plans with minimal oversight. Innovation, communication and collaborative problem-solving abilities are required.

JOB RESPONSIBILITIES:

• Formulate concepts, designs, and models for opto-mechanical packages of Uviquity products.
• Determine packaging specifications, opto-mechanical tolerances, thermo-mechanical design, and calibration plans for final assemblies.
• Evaluate and procure key materials such as optical adhesives, solders, fluxes, and thermal interface materials.
• Develop testing setups, components, and/or other prototypes (e.g. 3D printed parts) for rapid design feedback.
• Actively manage suppliers, manufacturing partners, and internal subject matter experts to ensure timely project execution.
• Plan and execute experiments with mechanical and opto-mechanical samples to validate package specifications and Failure Mode and Effects Analysis (FMEA).
• Document key R&D results for IP protection as well as work instructions, test criteria, and non-conformance actions in support of the manufacturing quality system.
• Work with cross-functional teams, consultants, and partners to ensure packages are cost-effective and meet performance requirements.
• Foster a collaborative and innovative culture across the organization, promoting knowledge sharing and continuous learning.

REQUIREMENTS:

• Bachelor’s Degree or higher in Electrical or Mechanical Engineering, Physics, Optics, Materials Science, or an equivalent field preferred; significant relevant experience will be considered.
• 5 years of hands-on packaging design, assembly, process integration, and/or qualification.
• Understanding of component requirements/functionality within a laser module and the ability to design to given performance targets.
• Understanding of thermal and mechanical constraints in packaging, such as heat transfer, mechanical stress, and thermo-electric cooling.
• Expertise in mechanical design processes and 3D CAD software, such as SolidWorks.
• Expertise in optical photonics numerical design and proficiency with simulation tools such as Zemax.
• Exposure to new product development (NPD), product release schedules, and quality/reliability requirements for optical components.
• Ability to perform in-lab hands-on experimentation and data analysis.
• Strong analytic and communication skills, flexibility, and ability to work well in a dynamic, multi-disciplinary environment.
• Working knowledge of on-chip passive optical devices (e.g. waveguides, etc.) and 2D/2.5D packaging (e.g. wire-bonding, interposers, etc.).
• Experience with III-Nitride blue laser diode packaging (e.g. 14-pin, TO-Cans, submount, die bonding) and/or packaging for optics covering the visible to ultraviolet is preferred.
• Knowledge of Statistical Process Control (SPC), Design for Manufacturing and Assembly (DfMA), Design of Experiments (DoE), and Root Cause Analysis is preferred.