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This startup is developing groundbreaking hardware, software, and systems to solve the critical bottlenecks in next-generation computing workloads – at any scale – across hyperscale cloud, edge, enterprise, 5G/6G, and automotive infrastructure. They recently received $50 million in funding and are ready to grow their world class team!
They are looking for a Lead Packaging Design Engineer to join their team and help contribute across the full lifecycle of complex package and system development, and who seek full ownership of large scale, challenging designs from concept to production.
San Francisco Bay Area (preferred), Boston, MA, or Raleigh, NC
Compensation: $250,000-$300,000 employee stock options benefits
Job Responsibilities
Job Requirements
All candidates must be authorized to work in the United States
Full Time
$90k-111k (estimate)
08/08/2024
09/23/2024