This startup is developing groundbreaking hardware, software, and systems to solve the critical bottlenecks in next-generation computing workloads – at any scale – across hyperscale cloud, edge, enterprise, 5G/6G, and automotive infrastructure. They recently received $50 million in funding and are ready to grow their world class team!

They are looking for a Lead Packaging Design Engineer to join their team and help contribute across the full lifecycle of complex package and system development, and who seek full ownership of large scale, challenging designs from concept to production.

San Francisco Bay Area (preferred), Boston, MA, or Raleigh, NC

Compensation: $250,000-$300,000 employee stock options benefits

Job Responsibilities

• Collaborate on package planning and integration with die, package, and PCB design teams.
• Develop package specifications and perform analysis for high-speed serdes interfaces.
• Conduct bring-up, testing, and characterization of high-speed serdes and memory interfaces.
• Analyze HBM and other advanced packaging technologies.
• Specify and analyze power and high-speed signaling requirements for high-speed networking systems across die, package, PCB, connectors, and cabling.
• Work alongside systems engineers to define and implement thermal management solutions for high-power networking devices.
• Provide support to operations team during package qualification and failure analysis processes

Job Requirements

• Minimum qualification of MS or PhD in Electrical Engineering (EE) or Mechanical Engineering (MechE), with over 10 years of relevant experience.
• Proficient in hands-on design of large body size, high power, high speed substrates using Cadence APD/SIP.
• Strong expertise in Signal Integrity (SI) and Power Integrity (PI), with mastery of Ansys HFSS and SiWave.
• Familiarity with package and PCB materials and their properties.
• Experience with 2.5D packaging and interposer integration is advantageous.
• Demonstrated success in leading substrate layout engineering teams.
• Direct involvement in production qualification and post-production activities.

All candidates must be authorized to work in the United States