• Bachelor of Science in Mechanical Engineering or related engineering field.
• 10 years of experience designing mechanical packaging for electronic control and power supply assemblies.
• Proficient in the use of 3D CAD software (preferably Siemens NX CAD / Unigraphics).
• Proficient in simulation tools to perform stress and thermal analyses of electronic assemblies (e.g. ANSYS, Icepak, CFD).
• Experience with the integration of rigid, flexible and rigi-flex printed circuit boards into mechanical assemblies.
• Familiar with electrical connectors and interconnect methodologies.
• Ability to travel 10% of the time.

What will your typical day look like?

• Work closely with the electrical and system engineers to design and model complex electronic assemblies involving the integration of PCBs and interconnects with a mechanical enclosure and parts.
• Design electronic enclosures and optimize panel architecture to meet project goals for performance, testability, manufacturability, and cost.
• Research/select connector and interconnect devices based on project requirements and vendor options.
• Apply industry best practices for ruggedized electronics, including but not limited to thermal management, EMC, shock and vibration.
• Create finite element models to simulate load cases and predict structural, fatigue, and dynamic characteristics of new products.
• Perform detailed thermal simulation of electronic assemblies to predict operating temperatures under various conditions. Conduct thermal mitigation tradeoff studies, often involving active and/or forced air cooling.
• Analyze detailed mechanical assembly characteristics, such as bolted joints, tolerance stack ups, and GD&T.
• Prepare and release design documentation (e.g. drawings, calculations, bills of material, and purchase specifications).
• Conduct technical design reviews with internal and external customers
• Support the organization with vendor selection, production launch and PPAP documentation.
• Lead and execute the validation and qualification of new products, components, and assemblies, with focus on mechanical and thermal performance, and electrical functional tests.
• Support multiple work assignments with shifting priorities and quickly pivot design direction as new information arises.