Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible.
This position is an opportunity to work on conceptualizing and productizing semiconductor-based electronic devices that bridge real world (analog) signals to (digital) cloud. You will be part of global manufacturing organization that is functionalizing sensing of our physical world and converting them to digital signals for intelligent processing. On a day-to-day basis, this position requires you to make tradeoff decision in multiple dimensions such as time-to-market, reliability, cost, and communication with engineering teams across different countries in Asia and Europe.
As an engineer, you are expected to:

• Work with cross-functional team to develop advanced IC packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups.
• Perform component or system level mechanical stress and thermal simulations
• Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification
• Document manufacturing process flows and control plans for IC packages at company’s external suppliers.
• Work with quality and reliability groups to establish the reliability criteria and qualification plan for various end applications.
• Communicate complex engineering ideas to global teams in simple and effective way but rooted in engineering principles.

Qualifications

• Minimum of Master’s degree in Engineering (mechanical engineering or electrical engineering).
• Required to have educational background in fundamentals of materials and their mechanical behavior. Ability to apply them in mechanical design.
• Must have hands-on experience with ability to perform deep dive in 3D CAD tools (e.g. SolidWorks) and FEA software ANSYS
• Prior internship experience in semiconductor IC or electronics assembly would be distinct advantage.
• During interview process, must be able to demonstrate exceptional communication skills, learning mindset, and problem-solving skillset.
• Candidates having work experience up to 1-year after master's graduation are encouraged to apply.

Estimated required travel time of <10%
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.EEO is the Law: Notice of Applicant Rights Under the Law.Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days