Role is on site at Applied Materials META Center on the UAlbany-NY Creates Nanotech Complex.

Key technology areas of experience: wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.

Key Responsibilities

Prefer a PhD in Materials Science or Electrical Engineering with a semiconductor focus.

Works with program managers, process engineers, NYCreates-CSR ecosystem, and end customers to integrate complex devices on silicon wafers.

Meets deadlines, uses structured problem solving and successfully integrates hundreds of process steps into functional devices in silicon.

Will work in the fabrication and development of BEOL processes and wafer level packaging. Experience should include end to end technology development including: process assumptions, ground rule generation, test site coordination and tape out, test site scheduling, setup and installation, route pipe cleaning, wafer processing logistics, test and characterization and process debug.

Key technology areas of experience: wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.

Interacts and offers solutions to address external customers unusually complex process issues to address customers High Value Problems (HVP) involving the business unit's product line

Participates in strategic planning to integrate research and development processes with both the unit and the Product Business Group's overall business plan

Functional Knowledge

• How to integrate silicon devices across a wide range of fields that include: CMOS, power, packaging, and optical devices
• FAB operations
• SiView or other MES systems
• Demonstrates broad and comprehensive understanding of device technology
• SPX or Coventor experience a plus

Leadership

• Leads through example, capable of leading small teams of process engineers or supporting module integrators.

Problem Solving

• Directs the resolution of highly complex or unusual business problems applying advanced analytical thought and judgment

Impact

• Guided by segment/functional strategy, impacts results of a department, business unit or sub-function or facilitates the work done by other segments/functions by providing support to impact the business

Interpersonal Skills

• Negotiates and influences the opinions of others at the executive level and in external organizations; exercises sensitivity to the audience
• Strong written, oral and presentation based communication
• Strong English skills

Position requires understanding of Applied Materials global Standards of Business Conduct and compliance with these standards at all times. This includes demonstrating the highest level of ethical conduct reflecting Applied Materials' core values.