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Attollo Engineering is a designer and manufacturer of cutting-edge infrared cameras and instruments for defense and industrial applications. Attollo has a full sensor fabricating facility and is a leading supplier of IR sensors in the defense and industrial space. Attollo believes in developing people to provide novel solutions for our customers. Attollo provides competitive salary compensation, a generous insurance package, and 401K matching.
Attollo Engineering is seeking an FPA Packaging Engineer responsible for all back-end manufacturing processing, and post wafer (front-end) processing. Critical areas of responsibility include flip-chip hybridization, Lap & Polish, AR coating, epoxy die bonding and wire-bonding. This role requires qualification and calibration of FPA packaging processes, equipment, and tooling. The ideal candidate has a background in mechanical engineering and IR FPA manufacturing in a cleanroom environment and possesses knowledge of detector and ROIC wafer processing. The successful candidate understands the importance of working as a team, optimizing manufacturing processes, sharing best practices, creating work instructions and training. This role requires the ability to juggle multiple priorities and projects in a fast-paced environment.
Role and Responsibilities
Qualifications and Education Requirements
Preferred Skills
Attollo is an equal opportunity employer, including disability and protected veterans. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
Full Time
$106k-128k (estimate)
07/01/2024
07/16/2024
attolloengineering.com
Camarillo, CA
<25
Semiconductor