Are you up for the challenge? Do you want free money in your 401k? Do you want job security and a company that invests in you? You need to check us out! In this exciting role you will lead the innovation and development of novel 2.5D / 3D advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufactability and reliability. ALONG WITH COMPETITIVE SALARIES AND OUR COMPREHENSIVE BENEFITS, WE OFFER: * Employee Performance Incentives * Ongoing Training Opportunities * Boeing Employee Discount Program * Health Insurance Opt-out Incentives * Generous 401k Contribution - 10% contribution (NOT A MATCH) * Student Debt Payoff * Up to $30k Tuition Assistance * HSA Contributions * Professional Development Program Every day, Boeing Intelligence & Analytics supports global missions by building and delivering intelligence, analytics, and cyber solutions that enable users to advance national security. We have provided our customers with the tools needed to counter evolving global and cyber threats, and to improve wartime decision making. Our talented employees bring software development, systems engineering, and advanced analytics expertise. We offer numerous prime contract opportunities with customers headquartered in Maryland, Virginia, and the District of Columbia, as well as subcontract opportunities that align with our areas of focus and additional opportunities nationwide through our parent company. What you will do (day in the life): * Lead analysis of customer and system requirements, development of architectural approaches, and detailed specifications for various electronic products * Lead reviews of testing and analysis activity to assure compliance to requirements * Lead activities in support of Supplier Management with make/buy recommendations and other technical services * Coordinate engineering support throughout the lifecycle of the product * Resolve complex issues on critical programs related to architectural approaches, requirements, specifications and design * Lead technical aspect of proposal preparation * Identify critical performance measures and develops processes for computing them. * Develop new concepts for future product designs to meet projected requirements Boeing Intelligence & Analytics (BI&A) is seeking an Experienced Microelectronics Packaging Engineer to join their team. Work Location: Huntington Beach, CA Telework Availability: This position allows for a hybrid work arrangement which is a combination of remote and on site work, generally includes routinely working virtually one or more days per week, schedules may vary by week depending on need to be on-site for test activities and/or for access to closed areas. Basic Qualifications (Required Skills/Experience): * Active TS/SCI clearance with polygraph * Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD 4 years' related work experience, Master 7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard. * 10 years of experience in the field of microelectronics packaging including MCM, heterogeneous integration, 3D chip stacking, etc * Understanding of impacts of complex packaging architectures on circuit performance including speed, thermal, etc * Experience with SWaP-C constrained electronics development * Demonstrated track record as a self-motived, independent, high-performance team member * Excellent verbal and written communication ability Preferred Qualifications (Desired Skills/Experience): * Understanding and experience with design, development and testing of advanced packaging techniques. This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (MCMs) and System-in-Package (SiP) for digital and RF products. * Understanding of 3DIC development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical and thermal considerations. * Understanding of commercial microelectronics fabrication process technologies, including standard substrates (organic, silicon and glass) and PCB manufacturing processes * Experience with industry standards for high-speed interconnects * Hold patents in advanced microelectronics packaging architectures and performance improvements * Experience working building and managing Outsourced Assembly and Test (OSAT) vendor supply chain * Experience organizing and leading cross-functional engineering teams including internal and external organizations * Experience supporting proposals (technical, cost, and schedule) with advanced microelectronics packaging content * Experience with technical, cost, and schedule management * Experience supporting military programs including engagement with customers * Active security clearance Boeing Intelligence & Analytics Benefits: Employees are more effective on the job when they are not distracted by health and financial worries. To support our workforce, we offer a wide variety of health, life and other insurance benefits (as described above) that allow each employee to choose the coverage best suited to their needs and the needs of their family. BI&A is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status. Equal Employment Opportunity is the Law (PDF)