Our client is undergoing rapid growth as the semiconductor space grows due to AI and other technology advances and we are in search of Field Service Technicians to assist in this major project growth. Duties and Responsibilities Install, deinstall, and qualify proprietary semiconductor equipment for high precision interconnection technology for IC Packaging. Specificity, Back-end Assembly Equipment on Chip to Wafer or Chip to Substrate bonding Analyze, interpret, and make critical decision on process and equipment related issues Interface with customers to ensure technical issues are addressed on a timely manner Provide technical training at customers facility Support machine Installation and Qualification (IQ) activities as defined by our customers Understanding customer requirements to ensure system meets requirements and generate new business opportunities Perform other duties as assigned Education and Experience Requirements Minimum of a high school diploma Experience working in an electro-mechanical manufacturing environment a plus Other Requirements Must be able to work with minimal supervision Good written and oral communication and interpersonal skills