Responsibilities

• Collect, Prepare, image, and document the structure and/or composition of nanostructures related to semiconductor devices.
• Manage the queue of samples and cleaving/analysis instructions from the Process Engineering staff
• Sample preparation by hand cleave and micro-cleaver using tweezers
• Sample highlighting including but not limited for dilute Hydrofluoric Acid
• Imaging sample features utilizing Scanning Electron Microscopy (SEM]
• Collecting compositional feature data utilizing Energy-dispersive X-ray spectroscopy (EDX)
• Communicating imaging results to the Engineering staff
• Development and optimization of analysis techniques
• Train new users on sample Preparation and Analysis Equipment
• Update and maintain Training and certification documents for sample Preparation and Analysis Equipment
• Actively participate and contribute to continuous SEM Operations efficiency improvement
• Possible responsibilities could include in FAB operations

Qualifications

• BS degree in Physical Science or equivalent experience is required
• Previous hands-on experience with X-SEM
• Hitachi SEM experience is greatly preferred
• Proficient use of handling samples - 5mm with tweezers required
• Experience working in a FAB environment is desired
• The unrestricted right to work in the USA is required

Physical Requirements Job duties are often performed in confined areas in a clean room environment, in awkward positions and/or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds is required. May require bending/stooping/crawling/climbing. May require the use of Personal Protection equipment and proper industry safety procedures when working with one or more dangerous element or conditions such as chemicals, electric currents or high voltage, moving mechanical parts, radiation, etc. Occasional overnight travel to TEL factory, training facilities and customer locations may be required.