Summary:

• The hardware application engineering position focuses on resolving customer issues on their HW/platform, customer design enablement, bring-up, and manufacture production.
• You should have strong working knowledge of the major computer industry standards such as PCIe Express, Ethernet, and miscellaneous interface.
• In this role you will
• Debug L1 ethernet issues related to Serdes and MAC/PHY (analyze Signal Strength, Serdes Eye, Review & Tune SI parameters etc.)
• Debug other interfaces on board such as PCIE, i2C, MDIO etc
• Perform Schematics and Layout reviews of the customer design / platform and provide feedback
• Interact with HW designers (board and ASIC) and write Hardware Design guidelines, Application Notes and publish Technical Bulletins
• Interface with board designers, ASIC /Serdes controller designers, program management, board vendors and component vendors to fully comprehend the board design parameters
• Generate PCB stack up recommendations that comprehend the full capabilities of industry available board fabrication materials and technologies
• Communicate effectively with customers considering both strategic and tactical aspects of the solution & work with internal cross-functional teams to deliver optimal solutions.

What we’re looking for:

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience Or Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.
• Must possess excellent written and verbal communication skills.
• Must be able to present and clearly articulate solutions to customers.
• Previous experience of working as an Application Engineer or any equivalent customer interacting role (i.e. ability to handle customers) is a must.

Key Requirements:

• Expertise in High Speed Ethernet Serdes interfaces: NRZ, PAM-4 100G.
• Expertise in Ethernet Physical layer (Layer 1) - Serdes, MAC, PCS including debugging L1 issues for Interop.
• Strong background in Signal Integrity, Power Integrity, Electromagnetics, Thermal, Multi-lane cross talk analysis and RF applications related to IC Package and PCB Design are required.
• Experience in using tools: HyperLynx, Ansoft SIWave and HFSS, ADS, Sigrity, PowerSI and PowerDC, Cadence Allegro, and Polar stack up
• Able to performance Schematics & Layout reviews effectively
• At Least one scripting language: Python / Perl / Unix shell

Experience in these areas are a plus:

• Expertise in MATLAB and Python a plus.
• Ability to handle Equipment’s: Servers (Windows / Linux), Scopes, Traffic generators (Ixia/Spirent/Xena), environmental chambers, Thermal Heads, Keysight VNA/TDR
• Ability to program High speed / optics modules and link up with various modules: LR, SR, ZR, ZR4, AECs etc.
• #LI-TM1

What are the 3-4 non-negotiable requirements of this position?

• Networking Ethernet background, Expertise in High Speed Ethernet Serdes interfaces: NRZ, PAM-4 100G.
• Expertise in Ethernet Physical layer (Layer 1) - Serdes, MAC, PCS including debugging L1 issues for Interop.
• Strong background in Signal Integrity, Power Integrity, Electromagnetics, Thermal, Multi-lane cross talk analysis and RF applications related to IC Package and PCB Design are required.
• Experience in using tools: HyperLynx, Ansoft SIWave and HFSS, ADS, Sigrity, PowerSI and PowerDC, Cadence Allegro, and Polar stack up Able to performance Schematics & Layout reviews effectively At least one scripting language: Python / Perl / Unix shell.