Electronics Packaging Design Engineer

Allient-Rochester (formerly ORMEC Systems, Inc.), a subsidiary of Allient Inc., specializing in motion control systems, including motion controllers, servo drives, motors, and integrated automation solutions is looking for a Electronics Packaging Design Engineer that will develop and design electronic and electro-mechanical enclosures and packaging for our motion control products. The ideal candidate will collaborate with cross-functional teams and suppliers to create high-quality designs that meet product requirements and industry standards. Apply now!

Responsibilities:

• Create and refine packaging and enclosure designs for electronic and electromechanical products that meet challenging requirements and are suitable for use in demanding industrial and medical environments.
• Perform mechanical design concept exploration, trade study analysis, down-selection, prototyping, and testing.
• Help define the design approach for a particular problem and independently execute assignments.
• Contribute high quality content for technical reports and presentations with minimal guidance.
• Proactively identify needs and concerns associated with design decisions and communicate them to project leadership.
• Engage with a cross-disciplinary team to formulate and design innovative products and ensure designs meet technical and commercial objectives.
• Support design reviews with internal teams and suppliers to ensure design integrity and manufacturability.
• Work with cross-functional team members, suppliers and other Allient business units to test and evaluate the performance of designs.
• Perform analysis and testing (e.g., temperature, shock, vibration, humidity) of electronics and design enclosures to ensure components operate reliably at required environmental specifications.
• Ensure designs comply with industry standards and regulations, such as IP ratings for ingress protection and other regulatory requirements.
• Develop CAD designs, part drawings, assembly drawings and bill of materials; document the remanufacturing process and maintain R-FMEAs (Remanufacturing-Failure Modes & Effects Analysis).
• Design test fixtures to support product testing and validation.
• Willingness to travel up to 5% as needed.

Qualifications:

• Bachelor's degree in Mechanical Engineering or a related field.
• Minimum of 10 years of industry experience in designing ruggedized electronics enclosure packaging.
• Proficiency in designing electro-mechanical assemblies that comply with thermal, EMI/EMC, shock, and vibration specifications.
• Experience with modeling PCBAs within enclosures.
• Proficiency in 3D CAD tools, such as SolidWorks’ or Autodesk Inventor.
• Proficiency in ERP tools, such as Dynamics 365.
• Experience designing for manufacturing, including material selection, and finishing processes.
• Experience with high volume manufacturing processes such as CNC, sheet metal fabrication, extrusion, injection molding, stamping, diecast, etc.
• Ability to perform thermal, modal, and vibration analyses of electronic assemblies with mechanical components.
• Familiarity with industry standards and regulations related to electronic enclosures, such as IP ratings, and EMI/EMC requirements.
• Strong verbal and written communication skills for effective collaboration and documentation.

Don't let this opportunity pass you by - APPLY TODAY!

To learn more about Allient Inc. visit www.Allient.com

Allient Inc. provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws. This applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation, and training.