What are the responsibilities and job description for the Head of Consumer Electronics Packaging Engineering (Requires Relocation) position at Shanghai BSF Human Resources Co., Ltd?
Job brief
We are seeking a highly qualified Package Process Engineering leader to join our dynamic team within the consumer electronics industry. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apple's packaging products and processes.
Responsibilities
- Research and Analysis
Conduct research on technology trends in the industry and competitors to formulate strategic development plans.
Develop and modify the company's technical management system and process standards, including safety regulations.
Oversee the introduction of new technologies and product development to expand product variety.
Engage in equipment selection, trial production, and process design for new product projects.
Address and coordinate solutions for technical issues during production and sales.
Lead the planning and implementation of initiatives related to new materials, processes, and automation, setting improvement goals.
Organize and participate in seminars to define development directions and technical frameworks.
Effectively lead project teams and manage priority initiatives to improve processes and outcomes.
Train and assess department personnel, ensuring they fulfill their responsibilities.
Requirements
J-18808-Ljbffr
