What are the responsibilities and job description for the Head of Consumer Electronics Packaging Engineering (Requires Relocation) position at Shanghai BSF?

Job brief

We are seeking a highly qualified Package Process Engineering leader to join our dynamic team within the consumer electronics industry. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apple’s packaging products and processes.

Responsibilities

Research and Analysis : Conduct research on technology trends in the industry and competitors to formulate strategic development plans.
Technical Management : Develop and modify the company's technical management system and process standards, including safety regulations.
New Technology Implementation : Oversee the introduction of new technologies and product development to expand product variety.
Project Participation : Engage in equipment selection, trial production, and process design for new product projects.
Problem Solving : Address and coordinate solutions for technical issues during production and sales.
Strategic Planning : Lead the planning and implementation of initiatives related to new materials, processes, and automation, setting improvement goals.
Technical Seminars : Organize and participate in seminars to define development directions and technical frameworks.
Project Leadership : Effectively lead project teams and manage priority initiatives to improve processes and outcomes.
Personnel Management : Train and assess department personnel, ensuring they fulfill their responsibilities.

Requirements

Experience : At least 10 years of package development or engineering experience, ideally in a key role within the consumer electronics sector.

Familiarity with Apple Products : Applicants should be well-versed in the manufacturing processes, automated machinery, and materials used in Apple’s packaging solutions.

Educational Background : A bachelor’s degree in Engineering or a package-related field is required.

Relocation : The position requires the candidate to be open to relocating to China for a long-term commitment.

Communication Skills : Experience in directly communicating with key personnel involved in Apple’s packaging products or engineering processes is preferred.

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Head of Consumer Electronics Packaging Engineering (Requires Relocation)

What are the responsibilities and job description for the Head of Consumer Electronics Packaging Engineering (Requires Relocation) position at Shanghai BSF?

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