What are the responsibilities and job description for the Head of Consumer Electronics Packaging Engineering position at Shanghai BSF Human Resources Co., Ltd?
Job brief
We are seeking a highly qualified Package Process Engineering leader to join our dynamic team within the consumer electronics industry. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apples packaging products and processes.
Responsibilities
- Research and Analysis : Conduct research on technology trends in the industry and competitors to formulate strategic development plans.
- Technical Management : Develop and modify the company's technical management system and process standards, including safety regulations.
- New Technology Implementation : Oversee the introduction of new technologies and product development to expand product variety.
- Project Participation : Engage in equipment selection, trial production, and process design for new product projects.
- Problem Solving : Address and coordinate solutions for technical issues during production and sales.
- Strategic Planning : Lead the planning and implementation of initiatives related to new materials, processes, and automation, setting improvement goals.
- Technical Seminars : Organize and participate in seminars to define development directions and technical frameworks.
- Project Leadership : Effectively lead project teams and manage priority initiatives to improve processes and outcomes.
- Personnel Management : Train and assess department personnel, ensuring they fulfill their responsibilities.
Requirements
