Job Posting for Sr. Director, Assembly Process Innovation at NXP Semiconductors
Role Summary
Lead a cross culture team (Kuala Lumpur, Malaysia; Bangkok, Thailand; Kaohsiung, Taiwan; and Tianjin, China) to introduce new packaging and products into NXP’s four internal assembly & test factories
The role need to be able to motive and develop the team to the next level in technical and stakeholder management to achieve the company’s goals
This team is manufacturing facing role, handing-off new processes, products, and technologies to the internal factories. Also engaged in selecting new equipment platforms. Key stakeholders also include Quality, other Package Innovation teams (business-facing and central), Procurement, etc.
Job Description
Spearhead packaging technology and process technology development to support product roadmap requirements for NXP’s internal AT manufacturing facilities.
Lead new technology and new product introductions with first pass qualification and safe launch success in a high-volume manufacturing environment.
Cultivate intrapreneurship in the team for both legacy and advanced packaging innovations that are competitive to contribute to NXP’s product roadmap, growth, and cost structure.
Forge collaborative partnerships both internally and externally for new capabilities and opportunities that help address NXP’s business, quality, efficiency, etc. goals.
Travel up to 25% to maintain and build relationships at the four factories and with Europe- and US-based stakeholders.
Job Qualification
Bachelor or above degree in Engineering major.
10 technical experience and expertise in packaging and assembly technology.
3 years of leadership experience in leading a group of managers.
Strong organizational leadership skills.
Strong execution focus along with the ability to inspire, engage, and motivate.
Strong communication and stakeholder management and influencing skills. Ability to identify, drive, and balance organization performing and transforming objectives and initiatives.
Good business acumen and packaging technical know-how.
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